TSMC is thus starting 2nm production by the end of the year and 1.4nm production seemingly in 2028. According to the news below, standard EUV equipment (not High NA) has been acquired for 1.4nm production. The news elaborates on the matter. A large-scale investment, as 30 older devices are being acquired.
TSMC is already moving at lightning speed, with R&D of the 1.4nm process starting at the Hsinchu plant, with the acquisition of 30 EUV machines.
What is interesting for us in the news is the following:
However, one move that TSMC refuses to make is to purchase ASML High-NA EUV machines, which cost $400 million apiece. However, this equipment will ensure the reliability in manufacturing 1.4nm and 1nm wafers at a higher yield. The company likely believes that the dollar value attached to this hardware does not equate to its actual value, which is why, according to Dan Nystedt and Commercial Times, TSMC is moving to photomask pellicles instead. Processes of sub-2nm must have a pellicle in the mix to prevent dust and other particles from contaminating the procedure.
Here are further justifications why pellicles are mandatory with older equipment in the <2nm class:
Again, this is a costly move that is accompanied by a great deal of complications. For instance, when producing 1.4nm and 1nm wafers using standard EUV machines, more exposure will be necessary, meaning that the photomask will be used often to achieve success, which can compromise yields. During this phase, the use of pellicles will be absolutely mandatory to prevent the aforementioned dust particles and contaminants from entering the wafer-manufacturing stage.
From this, one could probably conclude that pellicles will then be mandatory for TSMC starting from 2028. And that ‘whoever offers them pellicles will be happy’?
In the TJ review above, it was also mentioned that 1.6nm would start in H2/2026, but this should be checked. I don’t know if pellicles are mandatory here too. Such a conclusion could be drawn from the aforementioned news.
edit. here also a TSMC roadmap where 1.6nm is in 2026