Canatu - Hiilinanoputkikalvojen osaaja

[Koala]

@Kroisos_Pennonen

Reuters separately reported yesterday that ASML is exploring opportunities to expand into the advanced packaging equipment market. While this is not entirely new, the rationale is clear, as HBM stacking and chiplet architectures raise the requirements for optics and alignment precision. This expands the total addressable market (TAM), which consensus does not currently reflect. The impact is immaterial in the short term, but it adds further optionality to the EUV story.

Voisiko tämä tarkoittaa jopa ASML:n kiinnostusta hankkia Canatun semiconductor-liiketoiminta itselleen? Vertikaalinen integraatio voisi olla järkevä liike tässä.